Features and Benefits
- Low attenuation at 650, 850 and 1064nm
- Large core diameter for efficient coupling to LED and laser sources
- Performance over wide range of temperatures and humidity
- High tensile strength
- Good fatigue resistance
- USP Class VI nontoxic and biocompatible
- Sterilizable
Typical Applications
- Laser power delivery
- Short to medium distance communications (up to one km.)
- Factory automation
- Medical assemblies
- UV spectroscopy
Data by PN |
CF01493-18 |
CF01493-19 |
CF01493-20 |
CF01493-22 |
CF01493-60 |
Dimensions/Geometric Properties |
|
|
|
|
|
Core Diameter |
200 +/- 4 um |
300 +/- 6 um |
400 +/- 8 um |
600 +/- 10 um |
800 +/- 15 um |
HCS cladding diameter |
230 +0/-10 um |
330 +5/-10 um |
430 +5/-10 um |
630 +5/-10 um |
830 +/-15 um |
ETFE buffer diameter |
500 +/- 30 um |
650 +/- 30 um |
730 +/- 30 um |
1040 +/- 30 um |
1040 +/- 30 um |
Core/Cladding offset |
< 5 um |
< 6 um |
< 8 um |
< 8 um |
< 9 um |
Optical Properties |
|
|
|
|
|
Numerical Aperture |
0.37 |
0.37 |
0.37 |
0.37 |
0.37 |
Bandwidth @ 850nm |
> 20 MHz-km |
> 15 MHz-km |
> 13 MHz-km |
> 9 MHz-km |
N/A |
Attenuation @ 850nm |
< 12 dB/km |
< 12 dB/km |
< 12 dB/km |
< 12 dB/km |
< 12 dB/km |
Water content |
High OH |
High OH |
High OH |
High OH |
High OH |
Buffer and/or Coating Descriptions |
|
|
|
|
|
Cladding material |
*HCS |
*HCS |
*HCS |
*HCS |
*HCS |
Buffer material |
Tefzel (ETFE) |
Tefzel (ETFE) |
Tefzel (ETFE) |
Tefzel (ETFE) |
Tefzel (ETFE) |
Operating temperature |
-65 to +125 oC |
-65 to +125 oC |
-65 to +125 oC |
-65 to +125 oC |
-65 to +125 oC |
Mechanical and Testing Data |
|
|
|
|
|
Short-term bend radius |
> 10 mm |
> 15 mm |
> 29 mm |
> 58 mm |
> 73 mm |
Long-term bend radius |
> 16 mm |
> 24 mm |
> 47 mm |
> 94 mm |
> 118 mm |
Proof test level |
> 150 kpsi (1.033 GPa) |
> 150 kpsi (1.033 GPa) |
> 100 kpsi (0.689 GPa) |
> 75 kpsi (0.517 GPa) |
> 80 kpsi (0.551 GPa) |
*HCS is a registered trade mark of OFS Specialty Photonics Division
Spectral Attenuation(typical)
